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Fischer เครื่องมือวัดแบบสัมผัส | Fischer เครื่องมือวัด XRF | Restek | Restek Reference Standards | Analytichem | Lumex | Ellutia | JAI | Biometrics | Q-Tek GCMS | ข้อมูลบริษัท


    FISCHERSCOPE® X-RAY XDV®SDD

Features

  • Premium model with universal application characteristics
  • Highest excitation flexibility, for both the size of the measurement spot and the spectral composition
  • With the silicon drift detector, even very high intensities > 100 kcps can be processed without a loss in energy resolution
  • Very low detection limits and excellent repeatability
  • Large and easily accessible measurement chamber
  • Automated series testing with fast, programmable XY-stage

Typical fields of applications

  • Inspection of very thin coatings, e.g. in the electronics and semiconductor industries
  • Trace analysis, e. g. detection of harmful substances, according to RoHS, toy standards, packaging standards
  • Gold and precious metal analysis with highest precision
  • Photovoltaic industry
  • Measurement of thickness and composition of NiP-layers

X-RAY XDV-SDD X-RAY XDV-SDD X-RAY XDV-SDD

    High performance X-ray fluorescence (XRF) measuring system with a programmable XY-stage and Z-axis for automated measurements of very thin coatings and for trace analysis
    Measurements according to DIN EN ISO 3497 and ASTM B 568



    FISCHERSCOPE® X-RAY XDV®

Features

  • Measuring instrument optimised for micro-analysis
  • Depending on the X-ray optics, structures with a size of 100 µm or less can be analysed
  • Very high intensities and thus good precision
  • Even for thin coatings, measurement uncertainty < 1 nm possible
  • Suitable only for plane or nearly plane samples
  • Large and spacious measurement chamber with a cutout (C-slot)
  • Automated series testing with fast, programmable XY-stage

Typical fields of applications

  • Measurement of coating systems on PC Boards, leadframes and wafers
  • Measurement of coating systems on small components and thin wires
  • Materials analysis on small structures and small components

X-RAY XDV-u X_RAY_XDV_u X_RAY_XDV_u X_RAY_XDV_u

    X-ray fluorescence (XRF) measuring instrument with a polycapillary x-ray optics for automated measurements and analyses of coating thicknesses and compositions on very small components and structures
    Measurements according to DIN EN ISO 3497 and ASTM B 568



    FISCHERSCOPE® X-RAY XDV®-µ LD

Features

  • Microfocus tube Ultra with tungsten anode for even higher performance on smallest spots; Molybdenum anode optional
  • Changeable filter
  • Higher count rates and significantly reduced measurement times thanks to DPP+
  • Polycapillary optics allow particularly small measuring spots withshort measuring times with high intensity
  • Measuring spot approx.:Ø 60 µm
  • Determination of metal content in electroplating baths with corresponding accessories
  • Silicon drift detector with 20 or 50 mm2 active area for highest precision with thin layers
  • Up to 135 mm possible height of samples

Typical fields of applications

  • Measuring on smallest components and structures like assembled and complex shaped PCBs, plug contacts, bonding areas, SMD components or thin wires
  • Measuring of functional layers in the electronics and semiconductor industry
  • Determination of complex multilayer systems
  • Automated measuring, such as in quality control

X-RAY XDV-u X-RAY XDV-u X-RAY XDV-u



    FISCHERSCOPE® X-RAY XDV®-µ WAFER

Features

  • Microfocus tube Ultra with tungsten anode for even higher performance on smallest spots with µ- XRF; Molybdenum anode optional
  • 4-fold Changeable filter
  • DPP+ for highest precision even with short measuring times
  • In-house manufactured polycapillary optics allow especially small measuring spots with high intensity
  • Silicon drift detector with 20 or 50 mm2 for highest precision with thin layers
  • Vacuum table with holders for all standardwafer formats from 150- 300 mm
  • Measuring spot approx.:Ø 10 or 20 µm (FWHM)
  • Up to 5 mm possible height of samples
  • Extensive options for automation withWinFTM®

Typical fields of applications

  • Measuring of smallest structures on wafers up to 12 inch diameter
  • Analysis of very thin coatings, such as gold/palladium layers down to < 10 nm
  • Determination of complex multilayer systems
  • Automated measuring, such as in quality control

X-RAY XDV-u-WAFER X-RAY XDV-u-WAFER X-RAY XDV-u-WAFER



    FISCHERSCOPE® X-RAY XDV®-µ PCB

Features

  • Microfocus tube Ultra with tungsten anode for even higher performance on smallest spots : Molybdenum anode optional
  • 4-fold Changeable filter
  • Up to 10 mm possible height of samples
  • Polycapillary optics allow especially small measuring spots with short measuring times at high intensity
  • Measuring spot approx.:Ø 10 or 20 µm (FWHM)
  • High-precision programmable measuring table for PCBs up to 610 x 610mm, optionally with vacuum fixture
  • Silicon drift detector with 20 or 50 mm2 for highest precision with thin films
  • Vacuum table with holders for all standardwafer formats from 150- 300 mm
  • DPP+ for highest precision even with short measuring times

Typical fields of applications

  • Measuring of smallest flat components and structures on PCBs up to 610 x 610 mm (24 x 24 in)
  • Analysis of very thin coatings, such as gold/palladium layers down to < 3 nm or 10 nm
  • Automated measuring, such as in quality control
  • With the 10 μm option: Measuring with smallest measuring spot in combination with a large silicon drift detector
  • With the vacuum table option: Measuring on flexible PCBs
  • Full compliance with IPC standards 4552 and 4556 (ENIG, ENEPIG), 4553A (Silver) and 4554 (Tin)

X-RAY XDV-u PCB X-RAY XDV-u PCB


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